Probe card having configurable structure for exchanging or swapping electronic components for impedance matching

ABSTRACT

A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

CROSS REFERENCE

This application is a divisional of an application Ser. No. 13/044,564,filed on Mar. 10, 2011, now pending, which claims the priority benefitof Taiwan application serial no. 099107158, filed on Mar. 11, 2010. Theentirety of each of the above-mentioned patent applications is herebyincorporated by reference herein and made a part of this specification.

FIELD OF INVENTION

The invention relates to a probe apparatus, and especially relates to aprobe card having a configurable structure for exchanging electroniccomponents for impedance matching, and an impedance matching methodtherefore.

BACKGROUND OF THE INVENTION

A probe card is used as a signal transmission interface between a testerand a device under test. In order to efficiently transmit high-frequencytest signals, the impedance value of the probe card must be identical orsimilar to that of the tester and the device under test (DUT).

A plurality of known conventional methods is used to achieve the abovepurpose. For example, the quantity of conductive soldered joints in theprobe card are changed that can make the impedance value of the probecard identical or similar to that of the tester and the DUT. As anotherexample, the probe card with a plurality of coaxial probes can improveelectrical transmission capacity by lowering the parasitic capacitancebetween the coaxial probes. In yet another example, the impedance valueof the probe card is adjusted to be consistent with that of the testerand the DUT by exchanging/swapping electronic components with differentimpedance value.

The above described method could help in achieving the above purpose,but leave much to be desired. For instance, in the exchanging orswapping process of electronic components, the electronic component(e.g. an inductor) is directly welded with the conductive contact pad soas to be electrically connected. Therefore, when the measured impedancevalue of the probe card is not close to that of the tester and the DUT,and is higher than a predetermined value, the solder must be removedbefore the electronic component is taken off, and followed by welding anew electronic component having a different impedance value on the probecard for completing the exchanging/swapping process of the electroniccomponents.

However, in the operations for removing solder and for weldingelectronic component, the operational difficulties leads to theexchanging/swapping process to become more burdensome thereby loweringthe efficiency of the electrical testing. In addition, in the process ofmounting the new electronic component, the aligning of the tinyelectronic component with the conductive contact pad on the printedcircuit board is not an easy task, and thus making more difficult on theexchanging/swapping process. Furthermore, the electronic component isprone to be damaged during the solder removing and welding procedures.Therefore, due to the operational difficulties and the desire forefficient electrical testing, there is still room for improvement inmatching the impedance value of the probe card with that of the testerand the DUT by exchanging/swapping the electronic components.

SUMMARY OF THE INVENTION

In view of the foregoing, it is the primary object of this invention toprovide a probe card having a configurable structure for exchangingelectronic components for impedance matching. As a result, the speed forexchanging or swapping the electronic component can be faster so as toimprove the efficiency of the electrical testing.

To achieve the foregoing object, a probe card having a configurablestructure for exchanging electronic components for impedance matching isprovided for incorporation with the above-described method. The probecard includes a supporting unit, at least one electronic component, anda pressing device. The supporting unit has a surface which defines atleast one mounting area and at least one conductive contact pad isdisposed in the mounting area. The electronic component is disposed inthe mounting area and has a conductive end on the bottom. The pressingdevice is used for exerting an applied force so as to make theconductive end of the electronic component tightly contacted with theconductive contact pad of the supporting unit. Furthermore, theplacement seat is disposed on the supporting unit and has at least onehollowing portion that is corresponding to the mounting area, thepressing device has a pressing plate which is joined with the placementseat, the pressing plate is configured to be moved between a pressingposition and a non-pressing position in reference with respect to theplacement seat, the pressing plate has a pressing surface and thepressing surface is contacted with a top end of the electronic componentwhile the pressing plate is in the pressing position, and the stiffeneris joined with the supporting unit and attached on the one side of thesupporting unit having the mounting area, and the placement seat isjoined with the stiffener.

In the probe card, the pressing device comprises a pressing plate whichis configured to be moved between a pressing position and a non-pressingposition. The pressing plate has a pressing surface which is contactedwith a top end of the electronic component while the pressing plate isin the pressing position. Because of the downwardly applied force, theelectronic component is reliably electrically connected to theconductive contact pad.

In the probe card, a position alignment element is provided. Theposition alignment element has at least one opening which is alignedwith the conductive contact pad, and is used for containing theelectronic component. Because the electronic component can be alignedquickly with the conductive contact pad, the operational efficiency isimproved.

The above and other aspects, features, and advantages of the presentinvention will become more apparent from the following detaileddescription when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a flow chart of the exchanging/swapping of the electroniccomponents configured in the probe card.

FIG. 2 shows an exploded view of the first embodiment in the invention.

FIG. 3 shows a perspective view of the first embodiment in theinvention.

FIG. 4 shows a partial sectional view of the first embodiment in theinvention.

FIG. 5 shows a perspective view of the placement seat of the firstembodiment in the invention.

FIG. 6 shows a perspective view of the position alignment element of thefirst embodiment in the invention.

FIG. 7 is a partial sectional view which shows the anisotropicconductive paste being disposed between the electronic component and thecircuit board.

FIG. 8 shows an exploded view of the second embodiment in the invention.

FIG. 9 is a perspective view of the second embodiment in the inventionand shows the pressing plate is in the pressing position.

FIG. 10 is a perspective view of the second embodiment in the inventionand shows the pressing plate is in the non-pressing position.

FIG. 11 shows an exploded view of a third embodiment in the invention.

FIG. 12 shows an exploded view of a fourth embodiment in the invention.

FIG. 13 shows the pressing plate, the electronic component, and theconductive sheet of the fourth embodiment in the invention.

FIG. 14 shows a sectional view of a fifth embodiment in the invention.

FIG. 15 shows a sectional view of a sixth embodiment in the invention.

DETAILED DESCRIPTION OF THE INVENTION

The object of the invention is to ensure that the impedance value of atester is consistent with that of a device under test (DUT). Anexchanging/swapping process of the electronic components in the probecard is used in the method of the invention for achieving the foregoingobject. Please refer to FIG. 1, the above-said method includes:

Step (a): a supporting unit having a surface on which at least oneconductive contact pad and at least one electronic component aremounted. The supporting unit is a circuit board, for instance. Anapplied force is exerted on the electronic component so as toelectrically connect the electronic component with the conductivecontact pad.

Step (b): a probe card which includes the circuit board described instep (a) is mounted between the tester and the DUT.

Step (c): an impedance value between the tester and the DUT through theprobe card is measured. As the measured impedance value is not equal toa predetermined value, an exchanging process of electronic componentsthen takes place. The sequence of the exchanging process is as follows:(1) removing the applied force; (2) taking off the electronic componentfrom the circuit board; (3) mounting a new electronic component having adifferent impedance value and aligning the new electronic componentquickly with the conductive contact pad by using an alignment mechanism;(4) re-exerting the applied force on the new electronic component inorder to ensure the new electronic component is electrically connectedto the conductive contact pad of the circuit board. On the contrary, ifthe measured impedance value is equal to a predetermined value, theimpedance value of the probe card is matched to that of the tester andthe DUT.

Step (d): repeating step (c) until the measured impedance value beingequal to the predetermined value.

The above description is related to the method of the invention. Inorder to further describe a probe card which is used in conjunction withthe method of the invention and has a configurable structure forexchanging or swapping electronic components for impedance matching,several embodiments, taken in conjunction with the accompanyingdrawings, are described in the following description.

Please refer to FIG. 2-FIG. 4, a probe card 1 of a first embodiment inthe invention is shown. The probe card 1 includes a supporting unit suchas a circuit board 10, a stiffener 16, a placement seat 18, a positionalignment element 20, a plurality of electronic components 24, and apressing device such as a pressing plate 26.

The circuit board 10 is a hard printed circuit board. In thisembodiment, in reference with respect to a plurality of probe pins (notshown), a plurality of mounting areas 12 is defined in the reverse sideof the circuit board. A plurality of conductive contact pads 14 isdisposed on each of the mounting areas 12 according to particular usagerequirement. The following described herein below includes only onemounting area 12 as an illustrative example.

The stiffener 16 is an annular bracket that is fixedly coupled with thecircuit board 10 by a plurality of bolts, and is attached on the side ofthe circuit board 10 which has the mounting area 12. Because of therigidity of the stiffener 16 thereof, the stiffener 16 can therebysupport the circuit board 10 and enhance its flexural resistance.Furthermore, a plurality of threaded holes 16 a is disposed on thestiffener 16.

The placement seat 18 is fixedly coupled with the stiffener 16 bypenetrating two bolts 17 through the through holes 16 a and locking thebolts 17 with the stiffener 16. Please refer to FIG. 5 which shows theplacement seat 18 having a protrusion block 18 b. A trough 18 c and fourthreaded holes 18 d are formed on the protrusion block 18 b. Thethreaded holes 18 d are distributed around the trough 18 c, and formedas an alignment portion. A hollowing portion 18 e and two threaded holes18 d are formed in the trough 18 c. The hollowing portion 18 e is passedthrough the protrusion block 18 b and is corresponding to the mountingarea 12. A plurality of alignment pins 19 is individually inserted intoeach inserting holes 18 f, respectively.

Please refer to FIG. 6. The position alignment element 20 includes aflat plate 21 and a sunken plate 22. Each alignment pin 19 formed on theflat plate 21 is aligned with and inserted through two positioning holes21 a respectively, so that the flat plate 21 can be reliably containedin the trough 18 c of the placement seat 18. The sunken plate 22 issunken into the hollowing portion 18 e of the placement seat 18 when theflat plate 21 is joined with the trough 18 c. Furthermore, the sunkenplate 22 has a plurality of openings 22 a. The position of the openings22 a is corresponding to that of the conductive contact pads 14 on themounting area 12 of the circuit board 10.

In this embodiment, the electronic component 24 is, but not limited to,an inductor. The electronic component 24 has a top end 24 a and aconductive end 24 b on the bottom. As the electronic component 24 ismoved into and disposed in the openings 22 a of the position alignmentelement 20, the conductive end 24 b of the electronic component 24 isaligned with the conductive contact pad 14 of the circuit board 10.

The pressing plate 26 has two position alignment holes 26 a and fourthrough holes 26 b. The pressing plate 26 is aligned and assembled byaligning the position alignment holes 26 a of the pressing plate 26 withthe alignment pins 19 of the placement seat 18. Thereafter, four bolts27 are each penetrated through the through holes 26 b, respectively. Thepressing plate 26 is fixedly joined with the placement seat 18 bylocking one end of the bolts 27 into the threaded holes 18 d of theplacement seat 18, and the bolts 27 are formed as a connecting portion.At the same time, as the bolts 27 are locked tightly, the pressingsurface 26 c is pressed against the top ends 24 a of the electroniccomponents 24 (shown in FIG. 4) and exerts an applied force on theelectronic components 24. As a result, the conductive ends 24 b of theelectronic components 24 are reliably contacted and electricallyconnected to the conductive contact pads 14 of the circuit board 10. Theposition of the pressing plate 26 under this condition is defined as apressing position P1.

The above description is related to the probe card 1 of the firstembodiment in the invention. The probe card 1 under the condition asshown in FIG. 3 is mounted between the tester and the DUT, and receivesthe test signals from the tester. If the measured impedance value isequal to the predetermined value, the impedance value of the probe card1 is matched to that of the tester and the DUT. Thus, it is notnecessary to exchange or swap the electronic components for altering ormodifying the impedance value of the probe card 1.

If the measured impedance value is not equal to the predetermined value,the bolts 27 are released by a screw driver 27 and the pressing plate 26are taken off. The position of the taken-off pressing plate 26 isdefined as a non-pressing position P2 (shown in FIG. 2). After removingthe applied force exerted on the electronic component 24, the electroniccomponents 24 that are to be replaced are pick up by a tweezers, andproperly collected. Then, a new electronic component having a differentimpedance value is mounted on. Because of the alignment mechanismprovided by the openings 22 a of the position alignment element 20, thenew electronic component can be more quickly aligned with the conductivecontact pad 14 of the circuit board 10. Thereafter, the pressing plate26 is re-mounted on and joined with the placement seat 18 so as to makethe new electronic component electrically connected with the circuitboard 10. Thereafter, the impedance value between the tester and the DUTthrough the probe card 1 is measured, and the above-described steps inthis paragraph are repeated until the measured impedance value is equalto the predetermined value.

From above, an ordinary person skilled in the art should recognize fromthe above embodiment that the solder removing and re-welding processesare not needed for exchanging/swapping the electronic components,whereupon the electrical connection between the electronic component 24and the circuit board 10 is achieved instead by exerting applied forceon the electronic component 24. Therefore, as a result, the electroniccomponent 24 is not easily damaged and the speed for exchanging/swappingof the electronic components is increased, so that the efficiency of theelectrical testing is thereby improved. In addition, due to the positionalignment element 20 of the probe card 1, the new electronic componentscan be more quickly aligned with the conductive contact pads 14 of thecircuit board 10, so that the exchanging/swapping efficiency is furtherimproved.

Please refer to FIG. 7. In order to enhance the electrical conductingcapability between the electronic components and the circuit board,another embodiment further includes a conductive sheet 28 disposedbetween the electronic component 24 and the conductive contact pads 14of the circuit board 10. The conductive sheet 28, comprised of theanisotropic conductive paste or the like, is beneficial in electricallyconnecting the electronic components 24 with the circuit board 10 andprotecting the electronic components 24 when the electronic components24 are being removed.

Other embodiments of quickly exchanging/swapping the electroniccomponents are described in the following.

FIG. 8 shows a probe card 2 of a second embodiment in the invention. Themain differences between the probe card 2 of the second embodiment andthe probe card 1 of the first embodiment are described in the following.

In the placement seat 30 of the probe card 2, a pivot ear 32 and a pivotear 33 are disposed in the two sides of the hollowing portion 31,respectively. The alignment portion, comprised of a threaded hole 34, isdisposed near the hollowing portion 31 of the placement seat 30. Thepressing plate 35 is connected pivotally between the pivot ear 32 andthe pivot ear 33, and can be moved between the pressing position P1shown in FIG. 9 and the non-pressing position P2 shown in FIG. 10.Furthermore, a through hole 35 a is formed in the pressing plate 35, andis used for insertion by a bolt 36. The pressing plate 35 is fixed inthe pressing position P1 after locking the bolt 36 into the threadedhole 34 of the placement seat 30. The bolt 36 contributes to theconnecting portion of the invention. Furthermore, in the presentembodiment, a position alignment element 37 is opted to be disposed inthe probe card 2. The position alignment element 37 is completelycontained in the hollowing portion 31 and has a plurality of openings 37a to allow for quick alignment and containment of the electroniccomponents 38.

In the probe card 2 of the embodiment shown in FIG. 9, the electroniccomponents 38 are pressed against the pressing plate 35 to ensure betterelectrical connection between the electronic component 38 and thecircuit board 39. When the measured impedance value is not equal to thepredetermined value, the user only needs to unscrew the bolt 36 andraise up the pressing plate 35 (as shown in FIG. 10), and then swap outthe electronic components. Therefore, the probe card 2 in the embodimentalso has the benefit of quick exchanging/swapping of the electroniccomponents.

Although the placement seat is fixedly coupled with the stiffener in thefirst embodiment and the second embodiment, but it should be emphasizedthat the stiffener can be opted to be eliminated altogether, upon whichthe placement seat then can be directly locked into the circuit board.

FIG. 11 shows a probe card 3 of the third embodiment in the invention.In the probe card 3, a stiffener 40 is disposed, but the placement seatbeing similar to that shown in the first embodiment or the secondembodiment, thus no further description are required. It should beemphasized that the stiffener 40 is only used to enhance the flexuralresistance.

In the probe card 3 of the embodiment, two first coupling holes 41 a,two second coupling holes 41 b, and a threaded hole 41 c are formed inthe circuit board 41 and contributes as an alignment portion. The firstcoupling hole 41 a is used for being inserted by a first positioningalignment element 42, and the second coupling hole 41 b is used forbeing inserted by a second alignment element 42.

The position alignment element 44 is a plate having two through holes 44a and a plurality of openings 44 b. The position alignment element 44 isconnected with the circuit board 41 by engageably fitting the firstpositioning elements 42 in the through holes 44 a. The openings 44 b ofthe circuit board 41 are aligned with the conductive contact pads 41 d.

The pressing plate 45 has two positioning holes 45 a and a through hole45 b. The pressing plate 45 is pressed on the position alignment element44 by fittingly engaging the second positioning element 43 in thepositioning holes 45 a. Then, a connecting portion comprised of a bolt46 is penetrated through the through hole 45 b and locked into thethreaded hole 41 c of the circuit board 41, so as to make the pressingplate 45 pressed tightly on the position alignment element 44. At thesame time, a pressing surface 45 c of the pressing plate 45 is contactedwith the top end of the electronic component 47, so as to make theconductive ends on the bottom of the electronic components 47electrically connected with the conductive contact pads 41 d.

In the probe card 3, by the switching of the positioning of the pressingplate 45 between the pressing position and non-pressing position, theexchanging/swapping of the electronic components becomes easier.Furthermore, the position alignment element 44 is used for quickeralignment of the electronic components 47 with the conductive contactpads 41 d. Therefore, the probe card 3 in the present embodiment alsohas the benefit of quicker exchanging/swapping of the electroniccomponents.

FIG. 12 shows a probe card 4 of a fourth embodiment in the invention.The main difference between the probe card 4 and the probe cards in thefirst to third embodiments is that the position alignment element is notincluded in the probe card 4.

As shown in FIG. 13, a plurality of alignment troughs 54 a is formed inthe side of the pressing plate 54, so that a plurality of electroniccomponents 50 can each be quickly aligned with a plurality of electroniccontact pads 52 a in the circuit board 52, respectively. After each ofthe electronic components 50 is put in the alignment troughs 54 arespectively, the conductive sheet 55 is fixed on the pressing plate 54,so that the electronic components 50 can be reliably disposed in thealignment troughs 54 a. Then, the pressing plate 54 is turned over sothat the alignment troughs 54 b are aligned with the alignment pins 56which are inserted into the circuit board 52. Furthermore, a bolt 58 ispenetrated through a through hole 54 c and locked into a threaded hole52 b of the circuit board 52. Thus, a pressing surface 54 d which isformed on the inner surface of the alignment troughs 54 a is pressedtightly against the top ends of the electronic components 50, and theconductive ends on the bottom of the electronic components 50 are firmlyelectrically connected to a plurality of conductive contact pads 52 a ofthe circuit board 52, respectively.

FIG. 14 shows a probe card 5 of a fifth embodiment in the invention. Thedifference between the probe card 5 and those other probe cards in thefirst embodiment to the fourth embodiment is that a mounting area 62 ofthe circuit board 60 of the probe card 5 is defined in a side of thecircuit board 60 in which a plurality of probe pins (not shown) isdisposed. In addition, a plurality of conductive contact pads 64 isdisposed in the mounting area 62. In other words, a plurality ofelectronic components 66 and a pressing device, such as a pressing plate68, are disposed in the bottom side of the circuit board 60.

The assembled structure of the present embodiment is similar to theprobe card 1 in the first embodiment, but illustrates that the technicalfeatures of the exchanging/swapping of the electronic components can beapplicable in various conditions, so that the selection and adopting ofthe exchanging/swapping of the electronic components can be realizedaccording to the particular requirements as needed.

FIG. 15 shows a probe card 6 of a sixth embodiment in the invention. Themain difference between the probe card 6 and those other probe cards inthe first to the fifth embodiment is that the supporting unit of theprobe card 6 in the embodiment is a space transformer 70. The spacetransformer 70 is electrically connected with the bottom side of acircuit board 80, and is used to change the electrical transmissionpath, so that a layout pattern of the probe pins becomes more flexible.In the embodiment, a mounting area 72 is formed on the bottom area ofthe space transformer 70 and a plurality of conductive pads 74 isdisposed in the mounting area 72. The electronic components 76 and thepressing plate 78 are mounted on the mounting area 72 of the spacetransformer 70 in a similar method as the embodiment shown in FIG. 14.The electronic components 76 are firmly electrically connected with theconductive pads 74 because of the pressing force applied from thepressing plate 78.

It should be emphasized that the method for quicker alignment of theelectronic components involving the use of the alignment troughs whichare formed in the surface of the pressing plate and aligned with theconductive contact pads of the circuit board is not only applicable inthe probe card 4 of the fourth embodiment, but also can be applicable inthe first to third embodiment, the fifth embodiment, and the sixthembodiment by only requiring to remove the position alignment element.

It should also be emphasized that the method of disposing the conductivesheet or the like between the electronic components and the conductivecontact pads of the supporting unit for benefitting electricalconnection can also be applicable in the other embodiments.

Although the description above contains many specifics, these are merelyprovided to illustrate the invention and should not be construed aslimitations of the invention's scope. Thus it will be apparent to thoseskilled, in the art that various modifications and variations can bemade in the system and processes of the present invention withoutdeparting from the spirit or scope of the invention.

What is claimed is:
 1. A probe card having a configurable structure forexchanging electronic components for impedance matching comprising: asupporting unit, the supporting unit having a surface, the surfacedefining at least one mounting area, and at least one conductive contactpad being disposed in the mounting area; at least one electroniccomponent, the electronic component being disposed in the mounting areaand having a conductive end on the bottom, and the conductive end beingelectrically connected with the conductive contact pad; and a pressingdevice, the pressing device exerting an applied force so as to make theconductive end of the electronic component tightly contacted with theconductive contact pad of the supporting unit; wherein a placement seatis disposed on the supporting unit and has at least one hollowingportion that is corresponding to the mounting area, the pressing devicehas a pressing plate which is joined with the placement seat, thepressing plate is configured to be moved between a pressing position anda non-pressing position in reference with respect to the placement seat,the pressing plate has a pressing surface and the pressing surface iscontacted with a top end of the electronic component while the pressingplate is in the pressing position, and a stiffener is joined with thesupporting unit and attached on the one side of the supporting unithaving the mounting area, and the placement seat is joined with thestiffener.
 2. The probe card of claim 1, wherein the supporting unitcomprises at least one alignment portion, the pressing device comprisesa pressing plate and a connecting portion, the pressing plate isconfigured to be moved between a pressing position and a non-pressingposition in reference with respect to the supporting unit, the pressingplate has a pressing surface, the pressing surface is contacted with atop end of the electronic component while the pressing plate is in thepressing position, and the pressing plate is fixedly joined with thesupporting unit by connecting the connecting portion and the alignmentportion.
 3. The probe card of claim 2, further comprising a positionalignment element disposed on the supporting unit and located in themounting area, wherein the position alignment element has at least oneopening which is aligned with the conductive contact pad, the electroniccomponent is disposed in the opening of the position alignment element,and the conductive end of the electronic component is contacted with theconductive contact pad.
 4. The probe card of claim 3, wherein thesupporting unit comprises at least one first coupling hole and at leastone second coupling hole, one end of at least one first positioningelement is penetrated through the position alignment element andinserted into the first coupling hole so as to let the positionalignment element being joined with the supporting unit, the pressingdevice comprises at least one second positioning element, one end of thesecond positioning element is penetrated through the pressing plate andinserted into the second coupling hole so as to make the pressing platebeing pressed against the position alignment element.
 5. The probe cardof claim 2, wherein at least one positioning trough is formed in oneside of the pressing plate for containing the electronic component, andthe pressing surface is formed on the inner surface of the positioningtrough.
 6. The probe card of claim 2, wherein the alignment portion ofthe supporting unit is a threaded hole, the pressing plate of thepressing device has at least one through hole, and the connectingportion is a bolt which is penetrated through the through hole and islocked into the threaded hole.
 7. The probe card of claim 1, wherein theplacement seat comprises at least one alignment portion, the pressingdevice comprises at least one connecting portion, the pressing plate isfixedly joined with the placement seat by connecting the alignmentportion and the connecting portion, and is located in the pressingposition.
 8. The probe card of claim 7, further comprising a positionalignment element, wherein the position alignment element is containedin the hollowing portion of the placement seat, the position alignmentelement has at least one opening which is aligned with the conductivecontact pad, the electronic component is disposed in the opening of theposition alignment element, and the conductive end of the electroniccomponent is contacted with the conductive contact pad.
 9. The probecard of claim 8, wherein the placement seat has at least one insertinghole into which an alignment pin is inserted, the position alignmentelement has at least one positioning hole for which the alignment pin isaligned with and penetrated through, so as to align the opening of theposition alignment element with the conductive contact pad.
 10. Theprobe card of claim 7, wherein two pivot ears are disposed on the twoside of the hollowing portion in the placement seat respectively, thepressing plate is pivotally connected between the two pivot ears and isconfigured to be pivoted between the pressing position and non-pressingposition.
 11. The probe card of claim 10, wherein the position alignmentelement is disposed in the hollowing portion of the placement seat, atleast one opening is formed on the position alignment element for beingaligned with the conductive contact pad, and the electronic component isdisposed in the opening of the position alignment element, and theconductive end of the electronic component is contacted with theconductive contact pad.
 12. The probe card of claim 7, wherein thealignment portion of the placement seat is a threaded hole, the pressingplate of the pressing device has at least one through hole, and theconnecting portion is a bolt which is penetrated through the throughhole and is locked into the threaded hole.
 13. The probe card of claim7, wherein at least one positioning trough is formed in one side of thepressing plate of the pressing device for containing the electroniccomponent, and the pressing surface is formed on the inner surface ofthe positioning trough.
 14. The probe card of claim 1, furthercomprising a conductive sheet, wherein the conductive sheet is disposedbetween the electronic component and the supporting unit.
 15. The probecard of claim 1, wherein the supporting unit is a circuit board.
 16. Theprobe card of claim 1, wherein the supporting unit is a spacetransformer.